8" Diamond Wafering Blade (Fine Grit / Low Conc.), WB-0080LC alo-2108-p1200

Name: 8" Diamond Wafering Blade (Fine Grit / Low Conc.), WB-0080LC alo-2108-p1200
Brand: usep3asecurity.services
SKU: 27777878035
Price: 555.52 USD
Availability: InStock
Rating: 4.6669 (13 reviews)

usep3asecurity.services

$ 555.52

Tax included. Shipping calculated at checkout.

Description

8" Diamond Wafering Blade (Fine Grit / Low Conc.), WB-0080LC alo-2108-p12008 inch Diamond Wafering Blade (fine grit, low conc.)

078-inch x 32 mm (~1

10-inch 9 micron Diamond Abrasive Grinding Disk with PSA (adhesive backed) backing (each)

10-inch x 0

15 micron DIAMAT Monocrystalline Water-Based Diamond Abrasive Suspension

8-inch stainless steel high concentration diamond Wafering Blade

5-inch x 0

12-inch 1200 grit Alumina Grinding Papers (Plain Backed) (100/pkg)

12-inch 1200 grit SiC PSA (adhesive backed) Abrasive Grinding papers

14-inch 1200 grit SiC PSA (adhesive backed) Abrasive Grinding papers

16-inch x 0

25-inch) MAXCUT alumina/resin bonded abrasive blade (MOS 3800) (General purpose blade for steels and ferrous metals)

8-inch 125 micron Diamond Abrasive Grinding Disk with PSA backing (each)

Easy Shipping

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Your 8" Diamond Wafering Blade (Fine Grit / Low Conc.), WB-0080LC alo-2108-p1200 orders ship within 1-2 business days.

Delivery Options:

Standard: 3-7 business days
Fast: 2-3 business days
Express: 1-2 business days

Order Tracking:

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